Tiled display device

ABSTRACT

A tiled display device includes: a first display device including: a first display substrate having a plurality of light emitting areas; and a second color conversion substrate comprising a plurality of light transmitting areas respectively corresponding to the light emitting areas and comprising a light scattering material and a plurality of light blocking areas between the light transmitting areas; a second display device comprising a second display substrate and a second color conversion substrate, the second display device being at a side of the first display device; and a light scattering member between the first display device and the second display device and comprising a light scattering material, wherein an external light reflectance of the light scattering member is higher than an average value of an external light reflectance of the light transmitting areas and an external light reflectance of the light blocking areas.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority to and the benefit of KoreanPatent Application No. 10-2020-0056379 filed on May 12, 2020, in theKorean Intellectual Property Office, the disclosure of which isincorporated herein by reference in its entirety.

BACKGROUND 1. Field

Aspects of some example embodiments of the present disclosure relate toa tiled display device.

2. Description of the Related Art

As the information society develops, the demand for display devices fordisplaying images is increasing in various forms. For example, displaydevices may be incorporated into various electronic devices such assmartphones, digital cameras, notebook computers, navigation devices,and smart televisions. The display devices may be flat panel displaydevices such as liquid crystal display devices, field emission displaydevices, and organic light emitting display devices. Of the flat paneldisplay devices, a light emitting display device includes a lightemitting element that enables each pixel of a display panel to emitlight by itself. Thus, the light emitting display device can display animage without a backlight unit that provides light to the display panel.

When a display device is manufactured to have a relatively large size, adefect rate of light emitting elements may increase due to the relativeincrease in the number of pixels, and therefore productivity orreliability may be reduced. In an effort to address such issues, a tileddisplay device may be utilized to provide a large screen by connecting aplurality of relatively small display devices. The tiled display devicemay include a boundary part called a seam between the display devicesdue to a non-display area or a bezel area of each of the display devicesadjacent to each other. When one image is displayed on the entirescreen, the boundary part between the display areas gives a sense ofseparation to the entire screen, thereby reducing a sense of immersionin the image.

The above information disclosed in this Background section is only forenhancement of understanding of the background and therefore theinformation discussed in this Background section does not necessarilyconstitute prior art.

SUMMARY

Aspects of some example embodiments of the present disclosure include atiled display device which may eliminate or reduce a sense of separationbetween a plurality of display devices and improve a sense of immersionin images by preventing or reducing the visibility or perceptibility ofa boundary part or non-display areas between the display devices.

However, aspects of embodiments according to the present disclosure arenot restricted to those specifically described herein. The above andother aspects of embodiments according to the present disclosure willbecome more apparent to one of ordinary skill in the art to which thepresent disclosure pertains by referencing the detailed description ofthe present disclosure given below.

According to some example embodiments of the present disclosure, a tileddisplay device includes: a first display device which comprises adisplay substrate having a plurality of light emitting areas and a colorconversion substrate comprising a plurality of light transmitting areasarranged to respectively correspond to the light emitting areas andcomprising a light scattering material and a plurality of light blockingareas arranged between the light transmitting areas, a second displaydevice which comprises the display substrate and the color conversionsubstrate and is arranged at a side of the first display device, and alight scattering member which is arranged between the first displaydevice and the second display device and comprises a light scatteringmaterial. External light reflectance of the light scattering member ishigher than an average value of external light reflectance of the lighttransmitting areas and external light reflectance of the light blockingareas.

According to some example embodiments, the external light reflectance ofthe light scattering member may be substantially equal to external lightreflectance of the color conversion substrate.

According to some example embodiments, the external light reflectance ofthe light scattering member may be lower than the external lightreflectance of the light transmitting areas and higher than the externallight reflectance of the light blocking areas.

According to some example embodiments, the color conversion substratemay comprise: a base member which comprises the light transmitting areasand the light blocking areas, a plurality of color filters which are onthe base member, a plurality of wavelength converting units which are onthe color filters to correspond to some of the light transmitting areasand comprise the light scattering material, and a light transmittingunit which is arranged on the color filters to correspond to the otherone of the light transmitting areas and comprises the light scatteringmaterial.

According to some example embodiments, the color filters may comprise: afirst color filter which transmits light of a first color and overlaps afirst light transmitting area among the light transmitting areas, asecond color filter which transmits light of a second color and overlapsa second light transmitting area among the light transmitting areas, anda third color filter which transmits light of a third color and overlapsa third light transmitting area among the light transmitting areas andthe light blocking areas.

According to some example embodiments, the wavelength converting unitsmay comprise: a first wavelength converting unit which is arranged onthe first color filter and comprises a first wavelength shifterconverting a peak wavelength of incident light into a first peakwavelength and the light scattering material, and a second wavelengthconverting unit which is arranged on the second color filter andcomprises a second wavelength shifter converting a peak wavelength ofincident light into a second peak wavelength different from the firstpeak wavelength and the light scattering material.

According to some example embodiments, the first wavelength convertingunit or the second wavelength converting unit may be thicker than thelight scattering member.

According to some example embodiments, the light transmitting unit maybe arranged on the third color filter and transmits incident light whilemaintaining a peak wavelength of the incident light using the lightscattering material.

According to some example embodiments, the light transmitting unit maybe thicker than the light scattering member.

According to some example embodiments, the amount of the lightscattering material of the light transmitting unit per unit volume maybe greater than the amount of the scattering material of the lightscattering member per unit volume.

According to some example embodiments, each of the first display deviceand the second display device may further comprise: a connection padwhich is arranged on side surfaces of the display substrate and thecolor conversion substrate bonded to each other, and a flexible filmwhich is arranged on a surface of the connection pad using an adhesivefilm.

According to some example embodiments, the light scattering member maycover an upper surface of at least one of the connection pad, theadhesive film, or the flexible film.

According to some example embodiments, the tiled display device mayfurther comprise a light control film which covers the first displaydevice, the second display device, and the light scattering member.

According to some example embodiments, the tiled display device mayfurther comprise a cover module which covers side and lower surfaces ofthe first display device and the second display device.

According to some example embodiments of the present disclosure, a tileddisplay device includes: a first display device which comprises adisplay substrate having a plurality of light emitting areas and a colorconversion substrate comprising a plurality of light transmitting areasarranged to respectively correspond to the light emitting areas andcomprising a light scattering material and a plurality of light blockingareas arranged between the light transmitting areas, a second displaydevice which comprises the display substrate and the color conversionsubstrate and is located at a side of the first display device, and alight scattering member which is located between the first displaydevice and the second display device and comprises a light scatteringmaterial. External light reflectance of the light scattering member issubstantially equal to external light reflectance of the lightconversion substrate.

According to some example embodiments, the external light reflectance ofthe light scattering member may be lower than external light reflectanceof the light transmitting areas and higher than external lightreflectance of the light blocking areas.

According to some example embodiments, the color conversion substratemay comprise: a base member which comprises the light transmitting areasand the light blocking areas, first to third color filters which arearranged on the base member, a first wavelength converting unit which islocated on the first color filter and comprises a first wavelengthshifter converting a peak wavelength of incident light into a first peakwavelength and the light scattering material, a second wavelengthconverting unit which is on the second color filter and comprises asecond wavelength shifter converting a peak wavelength of incident lightinto a second peak wavelength different from the first peak wavelengthand the light scattering material, and a light transmitting unit whichis on the third color filter and transmits incident light whilemaintaining a peak wavelength of the incident light using the lightscattering material.

According to some example embodiments, the first wavelength convertingunit, the second wavelength converting unit, or the light transmittingunit may be thicker than the light scattering member.

According to some example embodiments, the amount of the lightscattering material of the light transmitting unit per unit volume maybe greater than the amount of the scattering material of the lightscattering member per unit volume.

According to some example embodiments, each of the first display deviceand the second display device may further comprise: a connection pad onside surfaces of the display substrate and the color conversionsubstrate bonded to each other, and a flexible film on a surface of theconnection pad using an adhesive film. The light scattering membercovers an upper surface of at least one of the connection pad, theadhesive film, or the flexible film.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects will become more apparent and more readilyappreciated from the following description of the example embodiments,taken in conjunction with the accompanying drawings in which:

FIG. 1 is a plan view of a tiled display device according to someexample embodiments;

FIG. 2 is a cross-sectional view of a display device of the tileddisplay device according to some example embodiments;

FIG. 3 is a plan view of a surface of a display substrate of the displaydevice according to some example embodiments;

FIG. 4 is a plan view of the other surface of the display substrate ofthe display device according to some example embodiments;

FIG. 5 is a plan view of a color conversion substrate of the displaydevice according to some example embodiments;

FIG. 6 is a cross-sectional view taken along the line I-I′ of FIGS. 3and 5 ;

FIG. 7 is a plan view illustrating the structure of a tiled displaydevice according to some example embodiments;

FIG. 8 is a cross-sectional view taken along the line II-II′ of FIG. 7 ;

FIG. 9 is an enlarged view of a light scattering member and a firstwavelength converting unit of FIG. 6 ;

FIG. 10 illustrates an example of a process of forming a lightscattering member in a tiled display device according to some exampleembodiments;

FIG. 11 illustrates an example of the process of forming a lightscattering member in a tiled display device according to some exampleembodiments;

FIG. 12 illustrates an example of the process of forming a lightscattering member in a tiled display device according to some exampleembodiments;

FIGS. 13A to 13C illustrate a process of manufacturing a tiled displaydevice according to some example embodiments;

FIGS. 14A to 14C illustrate a process of manufacturing a tiled displaydevice according to some example embodiments;

FIGS. 15A to 15C illustrate a process of manufacturing a tiled displaydevice according to some example embodiments; and

FIGS. 16A and 16B illustrate a process of manufacturing a tiled displaydevice according to some example embodiments.

DETAILED DESCRIPTION

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various example embodiments or implementations of theinvention. As used herein “embodiments” and “implementations” areinterchangeable words that are non-limiting examples of devices ormethods employing one or more of the inventive concepts disclosedherein. It is apparent, however, that various example embodiments may bepracticed without these specific details or with one or more equivalentarrangements. In other instances, well-known structures and devices areshown in block diagram form in order to avoid unnecessarily obscuringvarious example embodiments. Further, various example embodiments may bedifferent, but do not have to be exclusive. For example, specificshapes, configurations, and characteristics of an example embodiment maybe used or implemented in another example embodiment without departingfrom the spirit and scope of embodiments according to the inventiveconcepts.

Unless otherwise specified, the illustrated example embodiments are tobe understood as providing example features of varying detail of someways in which the inventive concepts may be implemented in practice.Therefore, unless otherwise specified, the features, components,modules, layers, films, panels, regions, and/or aspects, etc.(hereinafter individually or collectively referred to as “elements”), ofthe various embodiments may be otherwise combined, separated,interchanged, and/or rearranged without departing from the inventiveconcepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. When anexample embodiment may be implemented differently, a specific processorder may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order. Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element or layer, it may bedirectly on, connected to, or coupled to the other element or layer orintervening elements or layers may be present. When, however, an elementor layer is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. To this end, the term“connected” may refer to physical, electrical, and/or fluid connection,with or without intervening elements. Further, the X-axis, the Y-axis,and the Z-axis are not limited to three axes of a rectangular coordinatesystem, such as the x, y, and z axes, and may be interpreted in abroader sense. For example, the X-axis, the Y-axis, and the Z-axis maybe perpendicular to one another, or may represent different directionsthat are not perpendicular to one another. For the purposes of thisdisclosure, “at least one of X, Y, and Z” and “at least one selectedfrom the group consisting of X, Y, and Z” may be construed as X only, Yonly, Z only, or any combination of two or more of X, Y, and Z, such as,for instance, XYZ, XYY, YZ, and ZZ. As used herein, the term “and/or”includes any and all combinations of one or more of the associatedlisted items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one elements relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exampleterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various example embodiments are described herein with reference tosectional and/or exploded illustrations that are schematic illustrationsof idealized example embodiments and/or intermediate structures. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, example embodiments disclosed herein should notnecessarily be construed as limited to the particular illustrated shapesof regions, but are to include deviations in shapes that result from,for instance, manufacturing. In this manner, regions illustrated in thedrawings may be schematic in nature and the shapes of these regions maynot reflect actual shapes of regions of a device and, as such, are notnecessarily intended to be limiting.

As customary in the field, some example embodiments are described andillustrated in the accompanying drawings in terms of functional blocks,units, and/or modules. Those skilled in the art will appreciate thatthese blocks, units, and/or modules are physically implemented byelectronic (or optical) circuits, such as logic circuits, discretecomponents, microprocessors, hard-wired circuits, memory elements,wiring connections, and the like, which may be formed usingsemiconductor-based fabrication techniques or other manufacturingtechnologies. In the case of the blocks, units, and/or modules beingimplemented by microprocessors or other similar hardware, they may beprogrammed and controlled using software (e.g., microcode) to performvarious functions discussed herein and may optionally be driven byfirmware and/or software. It is also contemplated that each block, unit,and/or module may be implemented by dedicated hardware, or as acombination of dedicated hardware to perform some functions and aprocessor (e.g., one or more programmed microprocessors and associatedcircuitry) to perform other functions. Also, each block, unit, and/ormodule of some example embodiments may be physically separated into twoor more interacting and discrete blocks, units, and/or modules withoutdeparting from the scope of the inventive concepts. Further, the blocks,units, and/or modules of some example embodiments may be physicallycombined into more complex blocks, units, and/or modules withoutdeparting from the scope of the inventive concepts.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

FIG. 1 is a plan view of a tiled display device TD according to someexample embodiments.

Referring to FIG. 1 , the tiled display device TD may include aplurality of display devices 10. The display devices 10 may be arrangedin a lattice shape or matrix configuration, but embodiments according tothe present disclosure are not limited thereto. The display devices 10may be connected to each other in a first direction (X-axis direction)and a second direction (Y-axis direction), and the tiled display deviceTD may have a specific shape. For example, the display devices 10 mayhave the same size, but embodiments according to the present disclosureare not limited thereto. For example, according to some exampleembodiments, one or more of the display devices 10 may have differentsizes from other ones of the display devices 10.

Each of the display devices 10 may be shaped like a rectangle includinglong sides and short sides. The long sides or short sides of the displaydevices 10 may be connected to each other. Some of the display devices10 may be arranged at an edge of the tiled display device TD to form aside of the tiled display device TD. Some of the display devices 10 maybe arranged at corners of the tiled display device TD and may form twoadjacent sides of the tiled display device TD. The other ones of thedisplay devices 10 may be arranged inside the tiled display device TDand surrounded by other display devices 10.

Each of the display devices 10 may include a display area DA and anon-display area NDA. The display area DA may include a plurality ofpixels to display an image. The non-display area NDA may be arrangedaround the display area DA to surround the display area DA and may notdisplay an image.

The overall shape of the tiled display device TD may be a planar shape,but embodiments according to the present disclosure are not limitedthereto. The tiled display device TD may also have a three-dimensional(3D) shape to provide a 3D effect to a user. For example, when the tileddisplay device TD has a 3D shape, at least some of the display devices10 may have a curved shape. For another example, the display devices 10may each have a planar shape but may be connected to each other at apredetermined angle, so that the tiled display device TD can have a 3Dshape.

The tiled display device TD may be formed by connecting the respectivenon-display areas NDA of adjacent display devices 10. The displaydevices 10 may be connected to each other through a connection member oran adhesive member. Therefore, the non-display areas NDA between thedisplay devices 10 may be surrounded by adjacent display areas DA.External light reflectance of the display area DA of each of the displaydevices 10 and external light reflectance of the non-display areas NDAbetween the display devices 10 may be equal or substantially equal.Here, when the external light reflectance of the display area DA and theexternal light reflectance of the non-display areas NDA aresubstantially equal, it means that the non-display areas NDA between thedisplay devices 10 or a boundary part between the display devices 10 isnot perceived by a user. Therefore, the tiled display device TD mayeliminate or reduce a sense of separation between the display devices 10and improve a sense of immersion in images by preventing or reducingvisibility or perceptibility of the non-display areas NDA or theboundary part between the display devices 10.

FIG. 2 is a cross-sectional view of a display device 10 of the tileddisplay device TD according to some example embodiments.

Referring to FIG. 2 , the display device 10 may include a displaysubstrate 100, a color conversion substrate 300, a filler 500, and asealing member 600.

The display substrate 100 may emit light having a predetermined peakwavelength from a plurality of light emitting areas of the display areaDA. The display substrate 100 may include elements and circuits fordisplaying an image. For example, the display substrate 100 may includepixel circuits such as switching elements, a pixel defining layerdefining the light emitting areas of the display area DA, and self-lightemitting elements.

Examples of the self-light emitting elements may include organic lightemitting diodes, quantum dot light emitting diodes, and inorganicmaterial-based light emitting diodes. The inorganic material-based lightemitting diodes may have a micrometer or nanometer size. A case wherethe self-light emitting elements are organic light emitting diodes willhereinafter be described as an example.

The color conversion substrate 300 may be arranged on the displaysubstrate 100 and may face the display substrate 100. The colorconversion substrate 300 may include a plurality of light transmittingareas corresponding to the light emitting areas of the display substrate100. The color conversion substrate 300 may convert a peak wavelength oflight emitted from the light emitting areas of the display substrate 100and transmit the light with the converted peak wavelength or maymaintain the peak wavelength of the light emitted from the lightemitting areas of the display substrate 100 and transmit the light withthe maintained peak wavelength. For example, the display substrate 100may emit light having a predetermined peak wavelength, and the colorconversion substrate 300 may transmit at least two or more beams oflight having different peak wavelengths.

The filler 500 may be located in a space between the display substrate100 and the color conversion substrate 300 and may be surrounded by thesealing member 600. The filler 500 may fill the space between thedisplay substrate 100 and the color conversion substrate 300. Forexample, the filler 500 may be made of an organic material and maytransmit light. The filler 500 may be made of, but is not necessarilylimited to, a silicon-based organic material or an epoxy-based organicmaterial. For another example, the filler 500 may be omitted.

The sealing member 600 may be located between edges of the displaysubstrate 100 and edges of the color conversion substrate 300 in thenon-display area NDA. The sealing member 600 may be arranged along theedges of the display substrate 100 and the color conversion substrate300 in the non-display area NDA to seal the filler 500. The displaysubstrate 100 and the color conversion substrate 300 may be bonded toeach other through the sealing member 600. For example, the sealingmember 600 may include an organic material. The sealing member 600 maybe made of, but not necessarily limited to, epoxy-based resin.

FIG. 3 is a plan view of a surface of the display substrate 100 of thedisplay device 10 according to some example embodiments. Here, thesurface of the display substrate 100 may be a front surface or an uppersurface of the display substrate 100.

Referring to FIG. 3 , the display substrate 100 may include a pluralityof pixels arranged along a plurality of rows and a plurality of columnsin the display area DA. Each of the pixels may include a light emittingarea defined by the pixel defining layer and may emit light having apredetermined peak wavelength through the light emitting area. Forexample, the display area DA of the display substrate 100 may includefirst through third light emitting areas LA1 through LA3. Each of thefirst through third light emitting areas LA1 through LA3 may be an areawhere light generated by a light emitting element of the displaysubstrate 100 is emitted to the outside of the display substrate 100.

The first through third light emitting areas LA1 through LA3 may emitlight having a predetermined peak wavelength to the outside of thedisplay substrate 100. For example, the first through third lightemitting areas LA1 through LA3 may emit blue light. Light emitted fromthe first through third light emitting areas LA1 through LA3 may have apeak wavelength of 440 to 480 nanometers (nm).

The first through third light emitting areas LA1 through LA3 may besequentially and repeatedly arranged along the first direction (X-axisdirection) of the display area DA. For example, a width of the firstlight emitting area LA1 in the first direction (X-axis direction) may begreater than a width of the second light emitting area LA2 in the firstdirection, and the width of the second light emitting area LA2 in thefirst direction may be greater than a width of the third light emittingarea LA3 in the first direction. The width of each of the first throughthird light emitting areas LA1 through LA3 is not limited to theembodiment illustrated in FIG. 3 . For another example, the width of thefirst light emitting area LA1 in the first direction (X-axis direction),the width of the second light emitting area LA2 in the first direction,and the width of the third light emitting area LA3 in the firstdirection may be substantially equal.

For example, the area of the first light emitting area LA1 may be largerthan the area of the second light emitting area LA2, and the area of thesecond light emitting area LA2 may be larger than the area of the thirdlight emitting area LA3. The area of each of the first through thirdlight emitting areas LA1 through LA3 is not limited to the embodimentillustrated in FIG. 3 . For another example, the area of the first lightemitting area LA1, the area of the second light emitting area LA2, andthe area of the third light emitting area LA3 may be substantiallyequal.

FIG. 4 is a plan view of the other surface of the display substrate 100of the display device 10 according to some example embodiments. Here,the other surface of the display substrate 100 may be a back surface ora lower surface of the display substrate 100.

Referring to FIG. 4 , the display substrate 100 may include a first basemember SUB1.

The first base member SUB1 may be a base substrate and may be made of aninsulating material such as polymer resin. For example, the first basemember SUB1 may be a rigid substrate. For another example, the firstbase member SUB1 may be a flexible substrate that can be bent, folded,and rolled. When the first base member SUB1 is a flexible substrate, itmay be made of polyimide (PI), but the present disclosure is notnecessarily limited thereto.

The display device 10 may include a plurality of flexible films 210, aplurality of source drivers 220, source circuit boards 230, a pluralityof cables 240, a control circuit board 250, and a timing controller 260.

Each of the flexible films 210 may be arranged on an upper side or alower side of the display substrate 100. The flexible films 210 mayextend from side surfaces of the display device 10 to the lower surfaceof the display substrate 100. For example, the flexible films 210 may bearranged on side surfaces of the display substrate 100 and the colorconversion substrate 300 through side bonding. A side of each flexiblefilm 210 may be connected to a connection wiring of the displaysubstrate 100 on a side surface of the display substrate 100, and theother side of each flexible film 210 may be connected to a sourcecircuit board 230 on the lower surface of the display substrate 100. Forexample, the flexible films 210 may be anisotropic conductive films andmay transmit signals of the source drivers 220 or the source circuitboards 230 to the display substrate 100.

The source drivers 220 may be located on respective surfaces of theflexible films 210, respectively. For example, the source drivers 220may be integrated circuits. The source drivers 220 may convert digitalvideo data into analog data voltages based on a source control signal ofthe timing controller 260 and supply the analog data voltages to datalines of the display substrate 100 through the flexible films 210.

Each of the source circuit boards 230 may be located between theflexible films 210 and the cables 240. Each of the source circuit boards230 may be connected to the source drivers 220 or the display substrate100 through the flexible films 210 and may be connected to the controlcircuit board 250 or the timing controller 260 through the cables 240.For example, the source circuit boards 230 may be flexible printedcircuit boards or a printed circuit boards. The cables 240 may be, butare not limited to, flexible cables.

The control circuit board 250 may be connected to the source circuitboards 230 through the cables 240. For example, the control circuitboard 250 may be a flexible printed circuit board or a printed circuitboard.

The timing controller 260 may be located on a surface of the controlcircuit board 250. For example, the timing controller 260 may be anintegrated circuit. The timing controller 260 may receive digital videodata and timing signals from a system on chip of a system circuit board.The timing controller 260 may generate the source control signal basedon the timing signals and control the driving timings of the sourcedrivers 220 using the source control signal. The timing controller 260may generate a scan control signal based on the timing signals andcontrol the driving timing of a scan driver using the scan controlsignal.

The display device 10 may further include a power supply unit (or powersupply) located on or connected to the control circuit board 250. Thepower supply unit may generate voltages necessary for driving thedisplay substrate 100 from main power received from the system circuitboard and supply the generated voltages to the display substrate 100.For example, the power supply unit may generate driving voltages fordriving the source drivers 220, the timing controller 260, and the scandriver.

FIG. 5 is a plan view of the color conversion substrate 300 of thedisplay device 10 according to some example embodiments.

Referring to FIG. 5 , the color conversion substrate 300 may be arrangedon the display substrate 100 and may face the display substrate 100. Thecolor conversion substrate 300 may include a plurality of lighttransmitting areas corresponding to the light emitting areas of thedisplay substrate 100 and a plurality of light blocking areassurrounding the light transmitting areas. For example, the colorconversion substrate 300 may include first through third lighttransmitting areas TA1 through TA3 and first through third lightblocking areas BA1 through BA3. The first through third lighttransmitting areas TA1 through TA3 may correspond to the first throughthird light emitting areas LA1 through LA3 of the display substrate 100,respectively. The first through third light blocking areas BA1 throughBA3 may be located on respective sides of the first through third lighttransmitting areas TA1 through TA3, respectively, and may prevent orreduce color mixing of light emitted from the first through third lighttransmitting areas TA1 through TA3.

The color conversion substrate 300 may convert a peak wavelength oflight emitted from the light emitting areas of the display substrate 100and transmit the light with the converted peak wavelength or maymaintain the peak wavelength of the light emitted from the lightemitting areas of the display substrate 100 and transmit the light withthe maintained peak wavelength. For example, the first lighttransmitting area TA1 may convert a peak wavelength of light output fromthe display substrate 100 and emit light of a first color. The secondlight transmitting area TA2 may convert the peak wavelength of the lightoutput from the display substrate 100 and emit light of a second colordifferent from the first color. The third light transmitting area TA3may maintain the peak wavelength of the light output from the displaysubstrate 100 and emit light of a third color different from the firstcolor and the second color. For example, the light of the first colormay be red light having a peak wavelength of 610 to 650 nm, the light ofthe second color may be green light having a peak wavelength of 510 to550 nm, and the light of the third color may be blue light having a peakwavelength of 440 to 480 nm.

The first through third light transmitting areas TA1 through TA3 may besequentially and repeatedly arranged along the first direction (X-axisdirection) of the display area DA. For example, a width of the firstlight transmitting area TA1 in the first direction (X-axis direction)may be greater than a width of the second light transmitting area TA2 inthe first direction, and the width of the second light transmitting areaTA2 in the first direction may be greater than a width of the thirdlight transmitting area TA3 in the first direction. The width of each ofthe first through third light transmitting areas TA1 through TA3 is notlimited to the embodiment illustrated in FIG. 5 . For another example,the width of the first light transmitting area TA1 in the firstdirection (X-axis direction), the width of the second light transmittingarea TA2 in the first direction, and the width of the third lighttransmitting area TA3 in the first direction may be substantially equal.

For example, the area of the first light transmitting area TA1 may belarger than the area of the second light transmitting area TA2, and thearea of the second light transmitting area TA2 may be larger than thearea of the third light transmitting area TA3. The area of each of thefirst through third light transmitting areas TA1 through TA3 is notlimited to the embodiment illustrated in FIG. 5 . For another example,the area of the first light transmitting area TA1, the area of thesecond light transmitting area TA2, and the area of the third lighttransmitting area TA3 may be substantially equal.

FIG. 6 is a cross-sectional view taken along the line I-I′ of FIGS. 3and 5 .

Referring to FIG. 6 , the display area DA of the display substrate 100may include the first through third light emitting areas LA1 throughLA3. Each of the first through third light emitting areas LA1 throughLA3 may be an area where light generated by a light emitting element ofthe display substrate 100 is emitted to the outside of the displaysubstrate 100.

The display substrate 100 may include the first base member SUB1, abuffer layer BF, a thin-film transistor layer TFTL, light emittingelements EL, and an encapsulation layer TFE.

The first base member SUB1 may be a base substrate and may be made of aninsulating material such as polymer resin. For example, the first basemember SUB1 may be a rigid substrate. For another example, the firstbase member SUB1 may be a flexible substrate that can be bent, folded,and rolled. When the first base member SUB1 is a flexible substrate, itmay be made of polyimide (PI), but the present disclosure is notnecessarily limited thereto.

The buffer layer BF may be located on the first base member SUB1. Thebuffer layer BF may be an inorganic layer that can prevent or reduce theintroduction of air or moisture or other contaminants. For example, thebuffer layer BF may include a plurality of inorganic layers stackedalternately. The buffer layer BF may be a multilayer in which one ormore inorganic layers selected from a silicon nitride layer, a siliconoxynitride layer, a silicon oxide layer, a titanium oxide layer, and analuminum oxide layer are alternately stacked, but the present disclosureis not necessarily limited thereto.

The thin-film transistor layer TFTL may include thin-film transistorsTFT, a gate insulating layer GI, a connection wiring CWL, an interlayerinsulating film ILD, a passivation layer PAS, and a planarization layerOC.

The thin-film transistors TFT may be located on the buffer layer BF toform respective pixel circuits of a plurality of pixels. For example,the thin-film transistors TFT may be driving transistors or switchingtransistors of the pixel circuits. Each of the thin-film transistors TFTmay include a semiconductor layer ACT, a gate electrode GE, a sourceelectrode SE, and a drain electrode DE.

The semiconductor layer ACT may be provided on the buffer layer BF. Thesemiconductor layer ACT may be overlapped by the gate electrode GE, thesource electrode SE, and the drain electrode DE. The semiconductor layerACT may directly contact the source electrode SE and the drain electrodeDE and may face the gate electrode GE with the gate insulating layer GIinterposed between them.

The gate electrode GE may be located on the gate insulating layer GI.The gate electrode GE may overlap the semiconductor layer ACT with thegate insulating layer GI interposed between them.

The source electrode SE and the drain electrode DE may be located on theinterlayer insulating film ILD and spaced apart from each other. Thesource electrode SE may contact an end of the semiconductor layer ACTthrough a contact hole provided in the gate insulating layer GI and theinterlayer insulting film ILD. The drain electrode DE may contact theother end of the semiconductor layer ACT through a contact hole providedin the gate insulating layer GI and the interlayer insulating film ILD.The drain electrode DE may be connected to a first electrode AND of eachlight emitting element EL through a contact hole provided in thepassivation layer PAS and the planarization layer OC.

The gate insulating layer GI may be provided on the semiconductor layersACT. For example, the gate insulating layer GI may be located on thesemiconductor layers ACT and the buffer layer BF and may insulate thesemiconductor layers ACT from the gate electrodes GE. The gateinsulating layer GI may include contact holes through which the sourceelectrodes SE pass and contact holes through which the drain electrodesDE pass.

The connection wiring CWL may be located on the gate insulating layer GIon the periphery of the display substrate 100. The connection wiring CWLmay be electrically connected to a connection pad 700 located on a sidesurface of the display device 10 and may be connected to a plurality ofdata lines or a plurality of scan lines. The connection wiring CWL maybe connected to the data lines to provide data voltages or may beconnected to the scan lines to provide scan signals. In FIG. 6 , theconnection wiring CWL may be formed on the same layer and of the samematerial as the gate electrodes GE of the thin-film transistors TFT, butthe present disclosure is not necessarily limited thereto. For anotherexample, the connection wiring CWL may be formed on the same layer andof the same material as the source electrodes SE or the drain electrodesDE of the thin-film transistors TFT.

The interlayer insulating film ILD may be located on the gate electrodesGE. For example, the interlayer insulating film ILD may include contactholes through which the source electrodes SE pass and contact holesthrough which the drain electrodes DE pass. Here, the contact holes ofthe interlayer insulating film ILD may be connected to the contact holesof the gate insulating layer GI.

The passivation layer PAS may be provided on the thin-film transistorsTFT to protect the thin-film transistors TFT. For example, thepassivation layer PAS may include contact holes through which the firstelectrodes AND pass.

The planarization layer OC may be provided on the passivation layer PASto planarize the top of the thin-film transistors TFT. For example, theplanarization layer OC may include contact holes through which the firstelectrodes AND of the light emitting elements EL pass. Here, the contactholes of the planarization layer OC may be connected to the contactholes of the passivation layer PAS.

The light emitting elements EL may be provided on the thin-filmtransistors TFT. Each of the light emitting elements EL may include thefirst electrode AND, a light emitting layer E, and a second electrodeCAT.

The first electrode AND may be provided on the planarization layer OC.For example, the first electrode AND may be arranged to overlap one ofthe first through third light emitting areas LA1 through LA3 defined bya pixel defining layer PDL. In addition, the first electrode AND may beconnected to the drain electrode DE of each thin-film transistor TFT.

The light emitting layer E may be provided on the first electrode AND.The light emitting layer E may include a hole injection layer, a holetransport layer, a light receiving layer, an electron blocking layer, anelectron transport layer, an electron injection layer, etc. For example,the light emitting layer E may be an organic light emitting layer madeof an organic material, but the present disclosure is not necessarilylimited thereto. When the light emitting layer E is an organic lightemitting layer, a thin-film transistor TFT may apply a predeterminedvoltage to the first electrode AND of a light emitting element EL, andthe second electrode CAT of the light emitting element EL may receive acommon voltage or a cathode voltage. In addition, holes and electronsmay move to the organic light emitting layer E respectively through thehole transport layer and the electron transport layer and combine in theorganic light emitting layer E to emit light.

The second electrode CAT may be provided on the light emitting layer E.For example, the second electrode CAT may be implemented as an electrodecommon to all pixels without distinction between the pixels.

For another example, each light emitting element EL may include aninorganic material-based light emitting diode. In this case, each lightemitting element EL may have a micrometer or nanometer size and includean inorganic light emitting diode. The inorganic light emitting diodemay be aligned between two electrodes facing each other according to anelectric field formed in a specific field between the two electrodes.The inorganic light emitting diode may extend in one direction. Theinorganic light emitting diode may be shaped like a rod, a wire, a tube,or the like. The inorganic light emitting diode may be shaped like acylinder or a rod. Alternatively, the inorganic light emitting diode mayhave various shapes including polygonal prisms, such as a cube, arectangular parallelepiped and a hexagonal prism, and a shape extendingin a direction and partially inclined. A plurality of semiconductors ofthe inorganic light emitting diode may be sequentially arranged orstacked along one direction. The inorganic light emitting diode mayinclude a first semiconductor layer, a second semiconductor layer, anactive layer, an electrode layer, and an insulating layer.

The pixel defining layer PDL may define the first through third lightemitting areas LA1 through LA3. The pixel defining layer PDL mayseparate and insulate the respective first electrodes AND of the lightemitting elements EL from each other.

The encapsulation layer TFE may be arranged on the second electrode CATto cover the light emitting elements EL. The encapsulation layer TFE mayprevent or reduce instances of oxygen, moisture, or other contaminantspenetrating into the light emitting elements EL.

The color conversion substrate 300 may be located on the displaysubstrate 100 and may face the display substrate 100. The colorconversion substrate 300 may include the first through third lighttransmitting areas TA1 through TA3 and the first through third lightblocking area BA1 through BA3. The first through third lighttransmitting areas TA1 through TA3 may correspond to the first throughthird light emitting areas LA1 through LA3 of the display substrate 100,respectively. The first through third light blocking areas BA1 throughBA3 may be located on respective sides of the first through third lighttransmitting areas TA1 through TA3, respectively, and may prevent orreduce color mixing of light emitted from the first through third lighttransmitting areas TA1 through TA3.

The color conversion substrate 300 may include a second base memberSUB2, first through third color filters CF1 through CF3, a first cappinglayer CAP1, a first blocking member BK1, a second capping layer CAP2, asecond light blocking member BK2, first and second wavelength convertingunits (or first and second wavelength converters) WLC1 and WLC2, a lighttransmitting unit (or light transmitter) LTU, and a third capping layerCAP3.

The second base member SUB2 may be a base substrate and may be made ofan insulating material such as polymer resin. The second base memberSUB2 may include a light transmitting material to transmit light emittedfrom the first through third light transmitting areas TA1 through TA3.For example, the second base member SUB2 may be a rigid substrate. Foranother example, the second base member SUB2 may be a flexible substratethat can be bent, folded, and rolled. When the second base member SUB2is a flexible substrate, it may be made of polyimide (PI), but thepresent disclosure is not necessarily limited thereto.

Optionally, a separate buffer layer may be located on the second basemember SUB2 to prevent or reduce the introduction of impurities orcontaminants into a surface of the second base member SUB2. In thiscase, the first through third color filters CF1 through CF3 may directlycontact the buffer layer.

The first color filter CF1 may be located on the second base member SUB2and may overlap the first light transmitting area TA1. The first colorfilter CF1 may transmit only light of the first color (e.g., red light)and block or absorb light of the second color (e.g., green light) andlight of the third color (e.g., blue light). For example, the firstcolor filter CF1 may be a red color filter and may include a redcolorant. The red colorant may be made of red dye or red pigment.

The second color filter CF2 may be located on the second base memberSUB2 and may overlap the second light transmitting area TA2. The secondcolor filter CF2 may transmit only light of the second color (e.g.,green light) and block or absorb light of the first color (e.g., redlight) and light of the third color (e.g., blue light). For example, thesecond color filter CF2 may be a green color filter and may include agreen colorant. The green colorant may be made of green dye or greenpigment.

The third color filter CF3 may be located on the second base member SUB2and may overlap the third light transmitting area TA3. In addition, thethird color filter CF3 may overlap the first through third lightblocking areas BA1 through BA3. The third color filter CF3 may overlapthe first color filter CF1 or the second color filter CF2 in each of thefirst through third light blocking areas BA1 through BA3, therebypreventing or reducing color mixing of light emitted from the firstthrough third light transmitting areas TA1 through TA3. The third colorfilter CF3 may transmit only light of the third color (e.g., blue light)and block or absorb light of the first color (e.g., red light) and lightof the second color (e.g., green light). For example, the third colorfilter CF3 may be a blue color filter and may include a blue colorant.The blue colorant may be made of blue dye or blue pigment.

When the third color filter CF3 includes the blue colorant, externallight or reflected light that has passed through the third color filterCF3 may have a blue wavelength band. A user's eye color sensitivity mayvary according to the color of light. For example, light of the bluewavelength band may be perceived less sensitively by a user than lightof a green wavelength band and light of a red wavelength band.Therefore, because the third color filter CF includes the blue colorant,a user may perceive reflected light relatively less sensitively.

The first through third color filters CF1 through CF3 may absorb aportion of light introduced from the outside of the display device 10into the color conversion substrate 300, thereby reducing reflectedlight due to the external light. Therefore, the first through thirdcolor filters CF1 through CF3 may prevent or reduce color distortion dueto reflection of external light.

The first capping layer CAP1 may cover the first through third colorfilters CF1 through CF3 in the display area DA and cover the second basemember SUB2 in the non-display area NDA. The first capping layer CAP1may prevent damage or contamination of the first through third colorfilters CF1 through CF3 by preventing or reducing penetration ofimpurities such as moisture or air or other contaminants from theoutside. The first capping layer CAP1 may prevent or reduce instances ofthe colorants included in the first through third color filters CF1through CF3 being diffused to the first and second wavelength convertingunits WLC1 and WLC2 or the light transmitting unit LTU.

The first capping layer CAP1 may include an inorganic material. Forexample, the first capping layer CAP1 may include at least one ofsilicon nitride, aluminum nitride, zirconium nitride, titanium nitride,hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide,titanium oxide, tin oxide, cerium oxide, or silicon oxynitride.

A plurality of light blocking members BK may overlap the first throughlight blocking areas BA1 through BA3, respectively, and may be locatedon the first through third color filters CF1 through CF3. The lightblocking members BK may block transmission of light. For example, thelight blocking members BK may prevent or reduce color mixing bypreventing or reducing the intrusion of light between the first throughthird light transmitting areas TA1 through TA3, thereby improving acolor gamut. The light blocking members BK may be arranged in a latticeshape surrounding the first through third light transmitting areas TA1through TA3 in a plan view. The light blocking members BK may includethe first and second light blocking members BK1 and BK2.

The first light blocking member BK1 may be located on the first throughthird color filters CF1 through CF3. For example, the first lightblocking member BK1 may be directly arranged on the first capping layerCAP1 located on the first through third color filters CF1 through CF3.The first light blocking member BK1 may include an organic lightblocking material. For example, the first light blocking member BK1 mayinclude a black organic material. The first light blocking member BK1may be formed by coating and exposing an organic light blockingmaterial.

The second capping layer CAP2 may cover the first capping layer CAP1 inthe first through third light transmitting areas TA1 through TA3 and thenon-display area and may cover the first light blocking member BK1 inthe first through third light light blocking areas BA1 through BA3. Thesecond capping layer CAP2 may be additionally stacked on the firstcapping layer CAP1 to doubly prevent or reduce damage or contaminationof the first through third color filters CF1 through CF3. The secondcapping layer CAP2 may prevent or reduce instances of the colorantsincluded in the first through third color filters CF1 through CF3 beingdiffused to the first and second wavelength converting units WLC1 andWLC2 or the light transmitting unit LTU.

The second capping layer CAP2 may include an inorganic material. Thesecond capping layer CAP2 may be made of the same material as or adifferent material from the first capping layer CAP1. For example, thesecond capping layer CAP2 may include at least one of silicon nitride,aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride,tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tinoxide, cerium oxide, or silicon oxynitride.

The second light blocking member BK2 may be located on the first lightblocking member BK1. For example, the second light blocking member BK2may be located on the second capping layer CAP2 in the first throughthird light blocking areas BA1 through BA3. For example, the secondcapping layer CAP2 may cover an upper surface and both side surfaces ofthe first light blocking member BK1, and the second light blockingmember BK2 may be directly arranged on the second capping layer CAP2covering the upper surface of the first light blocking member BK1.

The second light blocking member BK2 may include an organic lightblocking material and a liquid repellent component. Here, the liquidrepellent component may be made of fluorine-containing monomers orfluorine-containing polymers, specifically, may includefluorine-containing aliphatic polycarbonate. For example, the secondlight blocking member BK2 may be made of a black organic materialincluding the liquid repellent component. The second light blockingmember BK2 may be formed by coating and exposing an organic lightblocking material including the liquid repellent component.

The second light blocking member BK2 including the liquid repellentcomponent may isolate the first and second wavelength converting unitsWLC1 and WLC2 and the light transmitting unit LTU in corresponding lighttransmitting areas. For example, when the first and second wavelengthconverting units WLC1 and WLC2 and the light transmitting unit LTU areformed using an inkjet method, an ink composition may flow on an uppersurface of the second light blocking member BK2. In this case, thesecond light blocking member BK2 including the liquid repellantcomponent may induce the ink composition to flow to each lighttransmitting area. Therefore, the second light blocking member BK2 mayprevent or reduce mixing of the ink composition.

Therefore, in a process of bonding the display substrate 100 and thecolor conversion substrate 300 together, the display device 10 maymaintain thicknesses of the first and second wavelength converting unitsWLC1 and WLC2 and the light transmitting unit LTU uniform and maintain athickness of the filler 500 filling the space between the displaysubstrate 100 and the color conversion substrate 300 uniform. Therefore,the display device 10 can prevent or reduce the occurrence of bondingdefects and stains.

The first wavelength converting unit WLC1 may be located on the firstcolor filter CF1 to overlap the first light transmitting area TA1. Thefirst wavelength converting unit WLC1 may be surrounded by the lightblocking members BK. The first wavelength converting unit WLC1 mayinclude a first base resin BS1, a first scatterer SCT1, and a firstwavelength shifter WLS1.

The first base resin BS1 may include a material having a relatively highlight transmittance. The first base resin BS1 may be made of atransparent organic material. For example, the first base resin BS1 mayinclude at least one of organic materials such as epoxy resin, acrylicresin, cardo resin, or imide resin.

The first scatterer SCT1 may have a refractive index different from thatof the first base resin BS1 and may form an optical interface with thefirst base resin BS1. For example, the first scatterer SCT1 may includea light scattering material or light scattering particles that scatterat least a portion of transmitted light. For example, the firstscatterer SCT1 may include metal oxide such as titanium oxide (TiO₂),zirconium oxide (ZrO₂), aluminum oxide (Al₂O₃), indium oxide (In₂O₃),zinc oxide (ZnO) or tin oxide (SnO₂) or may include organic particlessuch as acrylic resin or urethane resin. The first scatterer SCT1 mayscatter incident light in random directions regardless of an incidentdirection of the incident light without substantially converting a peakwavelength of the incident light.

The first wavelength shifter WLS1 may convert or shift a peak wavelengthof incident light into a first peak wavelength. For example, the firstwavelength shifter WLS1 may convert blue light received from the displaysubstrate 100 into red light having a single peak wavelength of 610 to650 nm and emit the red light. The first wavelength shifter WLS1 may bequantum dots, quantum rods, or phosphors. The quantum dots may beparticulate materials that emit light of a specific color when electronstransit from a conduction band to a valence band.

The quantum dots may be semiconductor nanocrystalline materials. Thequantum dots may have a specific band gap according to their compositionand size. Thus, the quantum dots may absorb light and then emit lighthaving a unique wavelength. Examples of semiconductor nanocrystals ofthe quantum dots may include group IV nanocrystals, group II-VI compoundnanocrystals, group III-V compound nanocrystals, group IV-VInanocrystals, and combinations of the same.

The group II-VI compounds may be selected from binary compounds selectedfrom CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, MgS andmixtures of the same; ternary compounds selected from InZnP, AgInS,CuInS, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe,CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe,MgZnSe, MgZnS and mixtures of the same; and quaternary compoundsselected from HgZnTeS, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe,CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe and mixtures of the same.

The group III-V compounds may be selected from binary compounds selectedfrom GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, InSband mixtures of the same; ternary compounds selected from GaNP, GaNAs,GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InNP,InAlP, InNAs, InNSb, InPAs, InPSb, GaAlNP and mixtures of the same; andquaternary compounds selected from GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb,GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb,InAlPAs, InAlPSb and mixtures of the same.

The group IV-VI compounds may be selected from binary compounds selectedfrom SnS, SnSe, SnTe, PbS, PbSe, PbTe and mixtures of the same; ternarycompounds selected from SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe,SnPbS, SnPbSe, SnPbTe and mixtures of the same; and quaternary compoundsselected from SnPbSSe, SnPbSeTe, SnPbSTe and mixtures of the same. Thegroup IV elements may be selected from silicon (Si), germanium (Ge), anda mixture of the same. The group IV compounds may be binary compoundsselected from silicon carbide (SiC), silicon germanium (SiGe), and amixture of the same.

For example, the binary, ternary or quaternary compounds may be presentin particles at a uniform concentration or may be present in the sameparticles at partially different concentrations.

For example, the quantum dots may have a core-shell structure includinga core containing the above-described nanocrystal and a shellsurrounding the core. The shell of each quantum dot may serve as aprotective layer for maintaining semiconductor characteristics bypreventing or reducing chemical denaturation of the core and/or as acharging layer for giving electrophoretic characteristics to the quantumdot. The shell may be a single layer or a multilayer. An interfacebetween the core and the shell may have a concentration gradient inwhich the concentration of an element present in the shell is reducedtoward the center. The shell of each quantum dot may be made of, forexample, a metal or non-metal oxide, a semiconductor compound, or acombination of the same.

For example, the metal or non-metal oxide may be, but is not limited to,a binary compound such as SiO₂, Al₂O₃, TiO₂, ZnO, MnO, Mn₂O₃, Mn₃O₄,CuO, FeO, Fe₂O₃, Fe₃O₄, CoO, Co₃O₄ or NiO or a ternary compound such asMgAl₂O₄, CoFe₂O₄, NiFe₂O₄ or CoMn₂O₄.

In addition, the semiconductor compound may be, but is not limited to,CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnSeS, ZnTeS, GaAs, GaP, GaSb, HgS,HgSe, HgTe, InAs, InP, InGaP, InSb, AlAs, AlP, or AlSb.

Light emitted from the first wavelength shifter WLS1 may have a fullwidth of half maximum (FWHM) of an emission wavelength spectrum of about45 nm or less, about 40 nm or less, or about 30 nm or less and mayfurther improve the color purity and color gamut of the display device10. In addition, the light emitted from the first wavelength shifterWLS1 may be radiated in various directions regardless of the incidentdirection of incident light. Therefore, the lateral visibility of redcolor displayed in the first light transmitting area TA1 can beimproved.

A portion of blue light provided by the display substrate 100 may betransmitted through the first wavelength converting unit WLC1 withoutbeing converted into red light by the first wavelength shifter WLS1. Ofthe blue light provided by the display substrate 100, light incident onthe first color filter CF1 without being converted by the firstwavelength converting unit WLC1 may be blocked by the first color filterCF1. In addition, red light into which a portion of the blue lightprovided by the display substrate 100 has been converted by the firstwavelength converting unit WLC1 may be emitted to the outside throughthe first color filter CF1. Therefore, the first light transmitting areaTA1 may emit red light.

The second wavelength converting unit WLC2 may be located on the secondcolor filter CF2 to overlap the second light transmitting area TA2. Thesecond wavelength converting unit WLC2 may be surrounded by the lightblocking members BK. The second wavelength converting unit WLC2 mayinclude a second base resin BS2, a second scatterer SCT2, and a secondwavelength shifter WLS2.

The second base resin BS2 may include a material having a relativelyhigh light transmittance. The second base resin BS2 may be made of atransparent organic material. For example, the second base resin BS2 maybe made of the same material as the first base resin BS1 or may beformed using the materials exemplified in the description of the firstbase resin BS1.

The second scatterer SCT2 may have a refractive index different fromthat of the second base resin BS2 and may form an optical interface withthe second base resin BS2. For example, the second scatterer SCT2 mayinclude a light scattering material or light scattering particles thatscatter at least a portion of transmitted light. For example, the secondscatterer SCT2 may be made of the same material as the first scattererSCT1 or may be formed using the materials exemplified in the descriptionof the first scatterer SCT1. The second scatterer SCT2 may scatterincident light in random directions regardless of an incident directionof the incident light without substantially converting a peak wavelengthof the incident light.

The second wavelength shifter WLS2 may convert or shift a peakwavelength of incident light into a second peak wavelength differentfrom the first peak wavelength of the first wavelength shifter WLS1. Forexample, the second wavelength shifter WLS2 may convert blue lightreceived from the display substrate 100 into green light having a singlepeak wavelength of 510 to 550 nm and emit the green light. The secondwavelength shifter WLS2 may be quantum dots, quantum rods, or phosphors.The second wavelength shifter WLS2 may include a material having thesame purpose as the materials exemplified in the description of thefirst wavelength shifter WLS1. The second wavelength shifter WLS2 may bemade of quantum dots, quantum rods, or phosphors such that itswavelength conversion range is different from the wavelength conversionrange of the first wavelength shifter WLS1.

The light transmitting unit LTU may be located on the third color filterCF3 to overlap the third light transmitting area TA3. The lighttransmitting unit LTU may be surrounded by the light blocking membersBK. The light transmitting unit LTU may transmit incident light whilemaintaining a peak wavelength of the incident light. The lighttransmitting unit LTU may include a third base resin BS3 and a thirdscatterer SCT3.

The third base resin BS3 may include a material having a relatively highlight transmittance. The third base resin BS3 may be made of atransparent organic material. For example, the third base resin BS3 maybe made of the same material as the first or second base resin BS1 orBS2 or may be formed using the materials exemplified in the descriptionof the first or second base resin BS1 or BS2.

The third scatterer SCT3 may have a refractive index different from thatof the third base resin BS3 and may form an optical interface with thethird base resin BS3. For example, the third scatterer SCT3 may includea light scattering material or light scattering particles that scatterat least a portion of transmitted light. For example, the thirdscatterer SCT3 may be made of the same material as the first or secondscatterer SCT1 or SCT2 or may be formed using the materials exemplifiedin the description of the first or second scatterer SCT1 or SCT2. Thethird scatterer SCT3 may scatter incident light in random directionsregardless of an incident direction of the incident light withoutsubstantially converting a peak wavelength of the incident light.

The third capping layer CAP3 may cover the first and second wavelengthconverting units WLC1 and WLC2, the light transmitting unit LTU, and thelight blocking members BK. For example, the third capping layer CAP3 mayseal the first and second wavelength converting units WLC1 and WLC2 andthe light transmitting unit LTU, thereby preventing or reducing damageor contamination of the first and second wavelength converting unitsWLC1 and WLC2 and the light transmitting unit LTU. The third cappinglayer CAP3 may be made of the same material as the first or secondcapping layer CAP1 or CAP2 or may be formed using the materialsexemplified in the description of the first or second capping layer CAP1or CAP2.

The filler 500 may be located in the space between the display substrate100 and the color conversion substrate 300 and may be surrounded by thesealing member 600. The filler 500 may fill the space between thedisplay substrate 100 and the color conversion substrate 300. Forexample, the filler 500 may be made of an organic material and maytransmit light. The filler 500 may be made of, but not necessarilylimited to, a silicon-based organic material or an epoxy-based organicmaterial. For another example, the filler 500 may be omitted.

The sealing member 600 may be interposed between the edges of thedisplay substrate 100 and the edges of the color conversion substrate300 in the non-display area NDA. The sealing member 600 may be arrangedalong the edges of the display substrate 100 and the color conversionsubstrate 300 in the non-display area NDA to seal the filler 500. Thedisplay substrate 100 and the color conversion substrate 300 may bebonded to each other through the sealing member 600. For example, thesealing member 600 may include an organic material. The sealing member600 may be made of, but not necessarily limited to, epoxy-based resin.

The display device 10 may further include the connection pad 700 and anadhesive film 800.

The connection pad 700 may be located on at least one side surface ofthe display device 10. The connection pad 700 may extend from a sidesurface of the display substrate 100 to a side surface of the colorconversion substrate 300. For example, the connection pad 700 may extendfrom the first base member SUB1 of the display substrate 100 to thesecond base member SUB2 of the color conversion substrate 300, but thepresent disclosure is not necessarily limited thereto. The connectionpad 700 may receive various voltages or signals from the flexible films210 and supply the voltages or signals to the connection wiring CWL.

The adhesive film 800 may attach the flexible films 210 to a surface ofthe connection pad 700. A surface of the adhesive film 800 may beattached to the surface of the connection pad 700, and the other surfaceof the adhesive film 800 may be attached to surfaces of the flexiblefilms 210. For example, the adhesive film 800 may cover the whole of theconnection pad 700, but the present disclosure is not necessarilylimited thereto. For another example, the adhesive film 800 may cover apart of the connection pad 700 and expose the other part of theconnection pad 700.

The adhesive film 800 may include an anisotropic conductive film. Whenthe adhesive film 800 includes an anisotropic conductive film, it mayhave conductivity in an area where the connection pad 700 contactscontact pads of the flexible films 210 and may electrically connect theflexible films 210 to the connection pad 700.

Optically, the adhesive film 800 may be omitted. In this case, theflexible films 210 may directly contact the connection pad 700. Forexample, the contact pads of the flexible films 210 may be connected tothe connection pad 700 using a method such as ultrasonic bonding orwelding.

Each of the flexible films 210 may be located on the upper side or thelower side of the display substrate 100. Each of the flexible films 210may extend from a side surface of the display device 10 to the lowersurface of the display substrate 100. For example, each of the flexiblefilms 210 may be located on the side surfaces of the display substrate100 and the color conversion substrate 300 through side bonding. A sideof each flexible film 210 may be connected to the connection wiring CWLof the display substrate 100 on the side surface of the displaysubstrate 100, and the other side of each flexible film 210 may beconnected to a source circuit board 230 on the lower surface of thedisplay substrate 100. For example, each of the flexible films 210 maybe an anisotropic conductive film and may transmit a signal of a sourcedriver 220 or the source circuit board 230 to the display substrate 100.

The tiled display device TD may further include a light scatteringmember LSM located between a plurality of display devices 10. The lightscattering member LSM may be located between the color conversionsubstrates 300 of the display devices 10. The light scattering memberLSM may cover the connection pad 700, the adhesive film 800, and theflexible films 210 located on a side surface of each of the displaydevices 10. Therefore, the light scattering member LSM can controlexternal light reflectance of the non-display areas NDA between thedisplay devices 10

The light scattering member LSM may include a base resin BS and ascatterer SCT.

The base resin BS may include a material having a relatively high lighttransmittance. The base resin BS may be made of a transparent organicmaterial. For example, the base resin BS may be made of the samematerial as the first through third base resins BS1 through BS3 of thecolor conversion substrate 300 or may be formed using the materialsexemplified in the description of the first through third base resinsBS1 through BS3.

The scatterer SCT may have a refractive index different from that of thebase resin BS and may form an optical interface with the base resin BS.For example, the scatterer SCT may include a light scattering materialor light scattering particles that scatter at least a portion oftransmitted light. For example, the scatterer SCT may be made of thesame material as the first through third scatterers SCT1 through SCT3 ofthe color conversion substrate 300 or may be formed using the materialsexemplified in the description of the first through third scatterersSCT1 through SCT3. The scatterer SCT may scatter light, which isincident from the outside, in random directions, and a portion of thescattered light may be reflected back to the outside of the tileddisplay device TD.

FIG. 7 is a plan view illustrating the structure of a tiled displaydevice TD according to some example embodiments. FIG. 8 is across-sectional view taken along the line II-II′ of FIG. 7 . The tileddisplay device TD of FIG. 7 is formed by connecting the display devices10 of FIGS. 1 and 2 . A description of some of the same elements asthose described above will be given briefly or may be omitted.

Referring to FIGS. 7 and 8 , the tiled display device TD may include aplurality of display devices 10 and an adhesive member AM. For example,the tiled display device TD may include first through fourth displaydevices 10-1 through 10-4. However, the number of the display devices 10is not limited to the embodiment illustrated in FIG. 7 . The number ofthe display devices 10 may be determined by the size of each displaydevice 10 and the size of the tiled display device TD.

The tiled display device TD may be formed by attaching side surfaces ofadjacent display devices 10 to each other using the adhesive member AMlocated between the display devices 10. The adhesive member AM mayconnect side surfaces of the first through fourth display devices 10-1through 10-4 arranged in a lattice shape, thereby realizing the tileddisplay device TD. For example, the adhesive member AM may be made of anadhesive or a double-sided tape having a relatively small thickness.Thus, a gap between the display devices 10 can be minimized.

Each of the first and second display devices 10-1 and 10-2 may include aconnection pad 700, an adhesive film 800, and flexible films 210 locatedbetween the first and second display devices 10-1 and 10-2. For example,when the connection pad 700, the adhesive film 800, and the flexiblefilms 210 are located on both sides (e.g., upper and lower sides or leftand right sides) of each display device 10, each of the first and seconddisplay devices 10-1 and 10-2 may include the connection pad 700, theadhesive film 800 and the flexible films 210 located between the firstand second display devices 10-1 and 10-2.

For another example, when the connection pad 700, the adhesive film 800,and the flexible films 210 are located on one side of the display device10, one of the adjacent first and second display devices 10-1 and 10-2may include the connection pad 700, the adhesive film 800 and theflexible films 210 located between the first and second display devices10-1 and 10-2, and the other display device 10 may not include theconnection pad 700, the adhesive film 800 and the flexible films 210located between the first and second display devices 10-1 and 10-2.Therefore, unlike in the embodiment of FIG. 8 , the connection pad 700,the adhesive film 800, and the flexible films 210 of one of the firstand second display devices 10-1 and 10-2 may be omitted.

The connection pad 700 may be located on at least one side surface ofeach display device 10. The connection pad 700 may extend from a sidesurface of a display substrate 100 to a side surface of a colorconversion substrate 300. For example, the connection pad 700 may extendfrom a first base member SUB1 of the display substrate 100 to a secondbase member SUB2 of the color conversion substrate 300, but the presentdisclosure is not necessarily limited thereto. The connection pad 700may receive various voltages or signals from the flexible films 210 andsupply the voltages or signals to a connection wiring CWL.

The adhesive film 800 may attach the flexible films 210 to a surface ofthe connection pad 700. A surface of the adhesive film 800 may beattached to the surface of the connection pad 700, and the other surfaceof the adhesive film 800 may be attached to surfaces of the flexiblefilms 210. For example, the adhesive film 800 may cover the whole of theconnection pad 700, but the present disclosure is not necessarilylimited thereto. For another example, the adhesive film 800 may cover apart of the connection pad 700 and expose the other part of theconnection pad 700.

The adhesive film 800 may include an anisotropic conductive film. Whenthe adhesive film 800 includes an anisotropic conductive film, it mayhave conductivity in an area where the connection pad 700 contactscontact pads of the flexible films 210 and may electrically connect theflexible films 210 to the connection pad 700.

Optically, the adhesive film 800 may be omitted. In this case, theflexible films 210 may directly contact the connection pad 700. Forexample, the contact pads of the flexible films 210 may be connected tothe connection pad 700 using a method such as ultrasonic bonding orwelding.

Each of the flexible films 210 may be located on an upper side or alower side of the display substrate 100. Each of the flexible films 210may extend from a side surface of each display device 10 to a lowersurface of the display substrate 100. For example, each of the flexiblefilms 210 may be located on the side surfaces of the display substrate100 and the color conversion substrate 300 through side bonding. A sideof each flexible film 210 may be connected to the connection wiring CWLof the display substrate 100 on the side surface of the displaysubstrate 100, and the other side of each flexible film 210 may beconnected to a source circuit board 230 on the lower surface of thedisplay substrate 100. For example, each of the flexible films 210 maybe an anisotropic conductive film and may transmit a signal of a sourcedriver 220 or the source circuit board 230 to the display substrate 100.

A light scattering member LSM may be arranged between the colorconversion substrates 300 of the display devices 10. The lightscattering member LSM may cover the connection pad 700, the adhesivefilm 800, and the flexible films 210 located on a side surface of eachof the display devices 10. Therefore, the light scattering member LSMcan control external light reflectance of non-display areas NDA betweenthe display devices 10

External light reflectance of the light scattering member LSM may besubstantially equal to external light reflectance of the colorconversion substrate 300. The light scattering member LSM may reflect aportion of incident external light EXL by using a light scatteringmaterial, and the color conversion substrate 300 may reflect a portionof the incident external light EXL by using light scattering materialsof first and second wavelength converting units WLC1 and WLC2 and alight transmitting unit LTU. For example, the light scattering memberLSM may reflect a portion of the incident external light EXL by using ascatterer SCT, and the color conversion substrate 300 may reflect aportion of the incident external light EXL by using first through thirdscatterers SCT1 through SCT3. When the tiled display device TD receivesthe same amount of the external light EXL, the amount of reflected lightRL1 of the light scattering member LSM may be substantially equal to theamount of reflected light RL2 of each of the first and second displaydevices 10-1 and 10-2. Therefore, the tiled display device TD mayeliminate a sense of separation between the display devices 10 andimprove a sense of immersion in images by preventing or reducing aboundary part or the non-display areas NDA between the display devices10 being perceived.

The reflected light RL2 of the color conversion substrate 300 mayinclude reflected light RL2 a of a plurality of light transmitting areasTA including a light scattering material and reflected light RL2 b of aplurality of light blocking areas BA not including a light scatteringmaterial. The light transmitting areas TA may correspond to the firstand second wavelength converting units WLC1 and WLC2 and the lighttransmitting unit LTU, and the light blocking areas BA may correspond toa plurality of light blocking members BK.

The external light reflectance of the light scattering member LSM may belower than external light reflectance of the light transmitting areas TAand higher than external light reflectance of the light blocking areasBA. For example, when the light scattering member LSM, the first andsecond wavelength converting units WLC1 and WLC2, and the lighttransmitting unit LTU include the same light scattering material, theexternal light reflectance of each of the light scattering member LSM,the first and second wavelength converting units WLC1 and WLC2 and thelight transmitting unit LTU may be proportional to the amount of thelight scattering material per unit volume. For example, the amount ofthe third scatterer SCT3 of the light transmitting unit LTU per unitvolume may be greater than the amount of the scatterer SCT of the lightscattering member LSM per unit volume.

The reflected light RL2 of the color conversion substrate 300 maycorrespond to the sum of the reflected light RL2 a of the lighttransmitting areas TA and the reflected light RL2 b of the lightblocking areas BA. In addition, as the area of each light transmittingarea TA of the color conversion substrate 300 increases, the amount ofthe reflected light RL2 of the color conversion substrate 300 mayincrease relatively. As the area of each light blocking area BAincreases, the amount of the reflected light RL2 of the color conversionsubstrate 300 may decrease relatively. When the external lightreflectance of the light scattering member LSM is lower than theexternal light reflectance of the light transmitting areas TA and higherthan the external light reflectance of the light blocking areas BA, adifference between the external light reflectance of the lightscattering member LSM and the external light reflectance of the colorconversion substrate 300 may reach a level at which a user cannotperceive the non-display areas NDA or the boundary part between thedisplay devices 10. Therefore, the tiled display device TD can preventor reduce visibility or perceptibility of the non-display areas NDA orthe boundary part between the display devices 10.

The external light reflectance of the light scattering member LSM may behigher than an average value of the external light reflectance of thelight transmitting area TA and the external light reflectance of thelight blocking areas BA. Here, the average value of the external lightreflectance of the light transmitting areas TA and the external lightreflectance of the light blocking areas BA may reflect an area ratio ofthe light transmitting areas TA to the light blocking areas BA. Forexample, when the tiled display device TD receives the same amount ofthe external light EXL and the area of each light transmitting area TAand the area of each light blocking area BA are equal, the average valueof the reflected light RL2 a of the light transmitting areas TA and thereflected light RL2 b of the light blocking areas BA may correspond to amedian value of the reflected light RL2 a of the light transmittingareas TA and the reflected light RL2 b of the light blocking areas BA(RL1>(RL2 a+RL2 b)/2). The difference between the external lightreflectance of the light scattering member LSM and the external lightreflectance of the color conversion substrate 300 may correspond to alevel at which a user cannot perceive the non-display areas NDA or theboundary part between the display devices 10. Therefore, the tileddisplay device TD can prevent or reduce perceptibility or visibility ofthe non-display areas NDA or the boundary part between the displaydevices 10.

FIG. 9 is an enlarged view of the light scattering member LSM and thefirst wavelength converting unit WLC1 of FIG. 6 .

Referring to FIG. 9 , a thickness T2 of the first wavelength convertingunit WLC1, the second wavelength converting unit WLC2, or the lighttransmitting unit LTU may be greater than a thickness T1 of the lightscattering member LSM. The respective thicknesses of the firstwavelength converting unit WLC1, the second wavelength converting unitWLC2, and the light transmitting unit LTU may be slightly differentdepending on the stacked structure of the color conversion substrate300. However, when the thickness T2 of each of the first wavelengthconverting unit WLC1, the second wavelength converting unit WLC2, andthe light transmitting unit LTU is compared with the thickness T1 of thelight scattering member LSM below, it is assumed that the thicknesses T2of the first wavelength converting unit WLC1, the second wavelengthconverting unit WLC2, and the light transmitting unit LTU aresubstantially equal.

External light reflectance of the light transmitting areas TA may behigher than external light reflectance of the light scattering memberLSM, and external light reflectance of the light blocking areas BA maybe lower than the external light reflectance of the light scatteringmember LSM. For example, when the light scattering member LSM, the firstand second wavelength converting units WLC1 and WLC2, and the lighttransmitting unit LTU include the same light scattering material, theexternal light reflectance of each of the light scattering member LSM,the first and second wavelength converting units WLC1 and WLC2, and thelight transmitting unit LTU may be proportional to the amount of thelight scattering material per unit volume.

Therefore, the thickness T2 of each of the first wavelength convertingunit WLC1, the second wavelength converting unit WLC2, and the lighttransmitting unit LTU may be greater than the thickness T1 of the lightscattering member LSM, and the amount of the third scatterer SCT3 of thelight transmitting unit LTU per unit volume may be greater than theamount of the scatterer SCT of the light scattering member LSM per unitvolume. The tiled display device TD can prevent or reduce perceptibilityor visibility of the non-display areas NDA or a boundary part between aplurality of display devices 10.

FIG. 10 illustrates an example of a process of forming a lightscattering member LSM in a tiled display device TD according to someexample embodiments.

Referring to FIG. 10 , the tiled display device TD may be formed byattaching side surfaces of adjacent display devices 10 to each otherusing an adhesive member AM located between the display devices 10. Toform the tiled display device TD, the display devices 10 may be bondedto each other using the adhesive member AM, and then the lightscattering member LSM may be formed between the display devices 10 byusing an ink ejector IJD. The ink ejector IJD may include an inkjet headHD and a nozzle NZ.

The inkjet head HD may be aligned at a position where the lightscattering member LSM is to be formed between the display devices 10.The ink ejector IJD may spray ink including a base member BS and ascatterer SCT by using the nozzle NZ. The amount of the scatterer SCT ofthe ink may be determined based on the amounts of respective firstthrough third scatterers SCT1 through SCT3 of first and secondwavelength converting units WLC1 and WLC2 and a light transmitting unitLTU. For example, the amount of the scatterer SCT of the ink may bedetermined based on the area and thickness of the light scatteringmember LSM, the area and thickness of each of the first and secondwavelength converting units WLC1 and WLC2 and the light transmittingunit LTU, and the amount of each of the first through third scatterersSCT1 through SCT3. The sprayed ink may cover connection pads 700,adhesive films 800, flexible films 210, and the adhesive member AMbetween the display devices 10. The ink applied between the displaydevices 10 may be heated and cured to provide the light scatteringmember LSM between the display devices 10.

FIG. 11 illustrates an example of the process of forming a lightscattering member LSM in a tiled display device TD according to someexample embodiments.

Referring to FIG. 11 , the tiled display device TD may be formed byattaching side surfaces of adjacent display devices 10 to each otherusing an adhesive member AM located between the display devices 10. Toform the tiled display device TD, the display devices 10 may be bondedto each other using the adhesive member AM, and then the lightscattering member LSM may be formed between the display devices 10 byusing a photoresist PR. For example, the photoresist PR may include abase member BS and a scatterer SCT.

The amount of the scatterer SCT of the photoresist PR may be determinedbased on the amounts of respective first through third scatterers SCT1through SCT3 of first and second wavelength converting units WLC1 andWLC2 and a light transmitting unit LTU. For example, the amount of thescatterer SCT of the photoresist PR may be determined based on the areaand thickness of the light scattering member LSM, the area and thicknessof each of the first and second wavelength converting units WLC1 andWLC2 and the light transmitting unit LTU, and the amount of each of thefirst through third scatterers SCT1 through SCT3.

For example, the photoresist PR may be a negative photoresist. Thephotoresist PR may be provided in a relatively wide area including aposition where the light scattering member LSM to be provided betweenthe display devices 10. When the photoresist PR is provided between thedisplay devices 10, a mask MSK may be placed except for an area wherethe light scattering member LSM is to be provided. In the tiled displaydevice TD, light may be irradiated toward the mask MSK and thephotoresist PR, and an area other than the light scattering member LSMmay be dissolved. Therefore, the light scattering member LSM may beprovided between the display devices 10.

For another example, the photoresist PR may be a positive photoresist.In this case, the light scattering member LSM may be formed using amethod not limited to that illustrated in FIG. 11 but corresponding tothe positive photoresist.

FIG. 12 illustrates an example of the process of forming a lightscattering member LSM in a tiled display device TD according to someexample embodiments.

Referring to FIG. 12 , the tiled display device TD may be formed byattaching side surfaces of adjacent display devices 10 to each otherusing an adhesive member AM located between the display devices 10. Toform the tiled display device TD, the display devices 10 may be bondedto each other using the adhesive member AM, and then the lightscattering member LSM may be formed between the display devices 10 byusing a film tape FT. For example, the film tape FT may have adhesivestrength and include a base member BS and a scatterer SCT.

The amount of the scatterer SCT of the film tape FT may be determinedbased on the amounts of respective first through third scatterers SCT1through SCT3 of first and second wavelength converting units WLC1 andWLC2 and a light transmitting unit LTU. For example, the amount of thescatterer SCT of the film tape FT may be determined based on the areaand thickness of the light scattering member LSM, the area and thicknessof each of the first and second wavelength converting units WLC1 andWLC2 and the light transmitting unit LTU, and the amount of each of thefirst through third scatterers SCT1 through SCT3.

FIGS. 13A to 13C illustrate a process of manufacturing a tiled displaydevice TD according to some example embodiments. FIGS. 13A through 13Cillustrate the process of manufacturing the tiled display device TD in atime sequence.

Referring to FIG. 13A, side surfaces of adjacent display devices 10 maybe attached to each other using an adhesive member AM located betweenthe display devices 10. After the display devices 10 are bonded to eachother using the adhesive member AM, a light scattering member LSM may beformed between the display devices 10 by using the inkjet methodillustrated in FIG. 10 , the photoresist method illustrated in FIG. 11 ,or the film tape method illustrated in FIG. 12 . The light scatteringmember LSM may cover a connection pad 700, an adhesive film 800,flexible films 210, and the adhesive member AM located on a side surfaceof each of the display devices 10.

Referring to FIG. 13B, after the light scattering member LSM is formedbetween the display devices 10, a light control film 20 may be providedto cover the display devices 10 and the light scattering member LSM. Forexample, the light control film 20 may be a low reflection film and mayreduce external light reflection of the tiled display device TD. Thelight control film 20 may be formed in one piece to cover the displaydevices 10 and the light scattering member LSM, but the presentdisclosure is not necessarily limited thereto.

After the light scattering member LSM is formed between the displaydevices 10, a printed circuit board process may be performed. Forexample, after the light scattering member LSM is formed between thedisplay devices 10, a source circuit board 230, a plurality of cables240, a control circuit board 250, and a timing controller 260 may beprovided on a lower surface of a display substrate 100 of each of thedisplay devices 10. The source circuit board 230 may be connected to theflexible films 210 or a plurality of source drivers 220.

Referring to FIG. 13C, after the formation of the light control film 20and the printed circuit board process, a cover module 30 may be providedto cover side and lower surfaces of the tiled display device TD.Optionally, the cover module 30 may be provided on edges of a frontsurface of the tiled display device TD, but the present disclosure isnot necessarily limited thereto. The cover module 30 may support andprotect the display devices 10 and form the side and rear exterior ofthe tiled display device TD.

FIGS. 14A to 14C illustrate a process of manufacturing a tiled displaydevice TD according to some example embodiments. FIGS. 14A through 14Cillustrate the process of manufacturing the tiled display device TD in atime sequence.

Referring to FIG. 14A, side surfaces of adjacent display devices 10 maybe attached to each other using an adhesive member AM located betweenthe display devices 10. After the display devices 10 are bonded to eachother using the adhesive member AM, a light scattering member LSM may beformed between the display devices 10 by using the inkjet methodillustrated in FIG. 10 , the photoresist method illustrated in FIG. 11 ,or the film tape method illustrated in FIG. 12 . The light scatteringmember LSM may cover a connection pad 700, an adhesive film 800,flexible films 210, and the adhesive member AM located on a side surfaceof each of the display devices 10.

Referring to FIG. 14B, after the light scattering member LSM is formedbetween the display devices 10, a printed circuit board process may beperformed. For example, after the light scattering member LSM is formedbetween the display devices 10, a source circuit board 230, a pluralityof cables 240, a control circuit board 250, and a timing controller 260may be provided on a lower surface of a display substrate 100 of each ofthe display devices 10. The source circuit board 230 may be connected tothe flexible films 210 or a plurality of source drivers 220.

After the printed circuit board process is performed, a cover module 30may be provided to cover side and lower surfaces of the tiled displaydevice TD. Optionally, the cover module 30 may be provided on edges of afront surface of the tiled display device TD, but the present disclosureis not necessarily limited thereto. The cover module 30 may support andprotect the display devices 10 and form the side and rear exterior ofthe tiled display device TD.

Referring to FIG. 14C, after the cover module 30 is provided, a lightcontrol film 20 may be provided to cover the display devices 10 and thelight scattering member LSM. For example, the light control film 20 maybe a low reflection film and may reduce external light reflection of thetiled display device TD. The light control film 20 may be formed in onepiece to cover the display devices 10 and the light scattering memberLSM, but the present disclosure is not necessarily limited thereto.

FIGS. 15A to 15C illustrate a process of manufacturing a tiled displaydevice TD according to some example embodiments. FIGS. 15A through 15Cillustrate the process of manufacturing the tiled display device TD in atime sequence.

Referring to FIG. 15A, side surfaces of adjacent display devices 10 maybe attached to each other using an adhesive member AM located betweenthe display devices 10. After the display devices 10 are bonded to eachother using the adhesive member AM, a printed circuit board process maybe performed. For example, after a light scattering member LSM is formedbetween the display devices 10, a source circuit board 230, a pluralityof cables 240, a control circuit board 250, and a timing controller 260may be provided on a lower surface of a display substrate 100 of each ofthe display devices 10. The source circuit board 230 may be connected toa plurality of flexible films 210 or a plurality of source drivers 220.

Referring to FIG. 15B, after the printed circuit board process isperformed, the light scattering member LSM may be formed between thedisplay devices 10 by using the inkjet method illustrated in FIG. 10 ,the photoresist method illustrated in FIG. 11 , or the film tape methodillustrated in FIG. 12 . The light scattering member LSM may cover aconnection pad 700, an adhesive film 800, the flexible films 210, andthe adhesive member AM arranged on a side surface of each of the displaydevices 10.

After the printed circuit board process is performed, a cover module 30may be provided to cover side and lower surfaces of the tiled displaydevice TD. Optionally, the cover module 30 may be provided on edges of afront surface of the tiled display device TD, but the present disclosureis not necessarily limited thereto. The cover module 30 may support andprotect the display devices 10 and form the side and rear exterior ofthe tiled display device TD.

Referring to FIG. 15C, after the cover module 30 is provided, a lightcontrol film 20 may be provided to cover the display devices 10 and thelight scattering member LSM. For example, the light control film 20 maybe a low reflection film and may reduce external light reflection of thetiled display device TD. The light control film 20 may be formed in onepiece to cover the display devices 10 and the light scattering memberLSM, but the present disclosure is not necessarily limited thereto.

FIGS. 16A and 16B illustrate a process of manufacturing a tiled displaydevice TD according to some example embodiments. FIGS. 16A and 16Billustrate the process of manufacturing the tiled display device TD in atime sequence.

Referring to FIG. 16A, side surfaces of adjacent display devices 10 maybe attached to each other using an adhesive member AM located betweenthe display devices 10. After the display devices 10 are bonded to eachother using the adhesive member AM, a printed circuit board process maybe performed. For example, after a light scattering member LSM is formedbetween the display devices 10, a source circuit board 230, a pluralityof cables 240, a control circuit board 250, and a timing controller 260may be provided on a lower surface of a display substrate 100 of each ofthe display devices 10. The source circuit board 230 may be connected toa plurality of flexible films 210 or a plurality of source drivers 220.

After the printed circuit board process is performed, a cover module 30may be provided to cover side and lower surfaces of the tiled displaydevice TD. Optionally, the cover module 30 may be provided on edges of afront surface of the tiled display device TD, but the present disclosureis not necessarily limited thereto. The cover module 30 may support andprotect the display devices 10 and form the side and rear exterior ofthe tiled display device TD.

Referring to FIG. 16B, after the cover module 30 is provided, the lightscattering member LSM may be formed between the display devices 10 byusing the inkjet method illustrated in FIG. 10 , the photoresist methodillustrated in FIG. 11 , or the film tape method illustrated in FIG. 12. The light scattering member LSM may cover a connection pad 700, anadhesive film 800, the flexible films 210, and the adhesive member AMlocated on a side surface of each of the display devices 10.

After the light scattering member LSM is formed between the displaydevices 10, a light control film 20 may be provided to cover the displaydevices 10 and the light scattering member LSM. For example, the lightcontrol film 20 may be a low reflection film and may reduce externallight reflection of the tiled display device TD. The light control film20 may be formed in one piece to cover the display devices 10 and thelight scattering member LSM, but the present disclosure is notnecessarily limited thereto.

A tiled display device according to embodiments includes a lightscattering member located between a plurality of display devices andincluding a light scattering material. Therefore, external lightreflectance of a display area of each of the display devices may besubstantially equal to external light reflectance of non-display areasbetween the display devices. Therefore, the tiled display device caneliminate or reduce a sense of separation between the display devicesand improve a sense of immersion in images by preventing or reducing theperceptibility or visibility of a boundary part or the non-display areasbetween the display devices.

However, the effects and characteristics of the embodiments according tothe present disclosure are not restricted to those specifically setforth herein. The above and other effects and characteristics of theembodiments will become more apparent to one of ordinary skill in theart to which the embodiments pertain by referencing the claims and theirequivalents.

What is claimed is:
 1. A tiled display device comprising: a firstdisplay device comprising: a first display substrate having a pluralityof light emitting areas; and a first color conversion substratecomprising a plurality of light transmitting areas respectivelycorresponding to the light emitting areas and comprising a lightscattering material and a plurality of light blocking areas between thelight transmitting areas; a second display device comprising a seconddisplay substrate and a second color conversion substrate, the seconddisplay device being at a side of the first display device; and a lightscattering member between the first display device and the seconddisplay device and comprising a light scattering material, wherein anexternal light reflectance of the light scattering member is higher thanan average value of an external light reflectance of the lighttransmitting areas and an external light reflectance of the lightblocking areas, wherein the first display device further comprises: aconnection pad on side surfaces of the first display substrate and thefirst color conversion substrate bonded to each other; and a flexiblefilm below the light scattering member on a surface of the connectionpad using an adhesive film, wherein the light scattering member coversan upper surface of at least one of the connection pad, the adhesivefilm, or the flexible film.
 2. The tiled display device of claim 1,wherein the external light reflectance of the light scattering member isequal to an external light reflectance of the first and second colorconversion substrates.
 3. The tiled display device of claim 1, whereinthe external light reflectance of the light scattering member is lowerthan the external light reflectance of the light transmitting areas andhigher than the external light reflectance of the light blocking areas.4. The tiled display device of claim 1, wherein the first and secondcolor conversion substrates each comprise: a base member which comprisesthe light transmitting areas and the light blocking areas; a pluralityof color filters on the base member; a plurality of wavelengthconverters on the color filters to correspond to some of the lighttransmitting areas and comprising the light scattering material; and alight transmitter on the color filters to correspond to the other one ofthe light transmitting areas and comprising the light scatteringmaterial.
 5. The tiled display device of claim 4, wherein the colorfilters comprise: a first color filter configured to transmit light of afirst color and overlapping a first light transmitting area among thelight transmitting areas; a second color filter configured to transmitlight of a second color and overlapping a second light transmitting areaamong the light transmitting areas; and a third color filter configuredto transmit light of a third color and overlapping a third lighttransmitting area among the light transmitting areas and the lightblocking areas.
 6. The tiled display device of claim 5, wherein thewavelength converters comprise: a first wavelength converter on thefirst color filter and comprising a first wavelength shifter configuredto convert a peak wavelength of incident light into a first peakwavelength and the light scattering material; and a second wavelengthconverter on the second color filter and comprising a second wavelengthshifter configured to convert a peak wavelength of incident light into asecond peak wavelength different from the first peak wavelength and thelight scattering material.
 7. The tiled display device of claim 6,wherein the first wavelength converter or the second wavelengthconverter is thicker than the light scattering member.
 8. The tileddisplay device of claim 5, wherein the light transmitter is on the thirdcolor filter and is configured to transmit incident light whilemaintaining a peak wavelength of the incident light using the lightscattering material.
 9. The tiled display device of claim 4, wherein thelight transmitter is thicker than the light scattering member.
 10. Thetiled display device of claim 4, wherein the amount of the lightscattering material of the light transmitter per unit volume is greaterthan the amount of the light scattering material of the light scatteringmember per unit volume.
 11. The tiled display device of claim 1, furthercomprising a light control film covering the first display device, thesecond display device, and the light scattering member.
 12. The tileddisplay device of claim 11, further comprising a cover module coveringside and lower surfaces of the first display device and the seconddisplay device.
 13. A tiled display device comprising: a first displaydevice comprising: a first display substrate having a plurality of lightemitting areas; and a first color conversion substrate comprising aplurality of light transmitting areas arranged to respectivelycorrespond to the light emitting areas and comprising a light scatteringmaterial and a plurality of light blocking areas between the lighttransmitting areas; a second display device comprising a second displaysubstrate and a second color conversion substrate, the second displaydevice being at a side of the first display device; and a lightscattering member between the first display device and the seconddisplay device and comprising a light scattering material, wherein anexternal light reflectance of the light scattering member is equal to anexternal light reflectance of the first and second color conversionsubstrates, wherein the first display device further comprises: aconnection pad on side surfaces of the first display substrate and thefirst color conversion substrate bonded to each other; and a flexiblefilm below the light scattering member on a surface of the connectionpad using an adhesive film, wherein the light scattering member coversan upper surface of at least one of the connection pad, the adhesivefilm, or the flexible film.
 14. The tiled display device of claim 13,wherein the external light reflectance of the light scattering member islower than an external light reflectance of the light transmitting areasand higher than an external light reflectance of the light blockingareas.
 15. The tiled display device of claim 13, wherein the first colorconversion substrate comprises: a base member comprising the lighttransmitting areas and the light blocking areas; first to third colorfilters on the base member; a first wavelength converter on the firstcolor filter and comprising a first wavelength shifter configured toconvert a peak wavelength of incident light into a first peak wavelengthand the light scattering material; a second wavelength converter on thesecond color filter and comprising a second wavelength shifterconfigured to convert a peak wavelength of incident light into a secondpeak wavelength different from the first peak wavelength and the lightscattering material; and a light transmitter on the third color filterand configured to transmit incident light while maintaining a peakwavelength of the incident light using the light scattering material.16. The tiled display device of claim 15, wherein the first wavelengthconverter, the second wavelength converter, or the light transmitter isthicker than the light scattering member.
 17. The tiled display deviceof claim 15, wherein the amount of the light scattering material of thelight transmitter per unit volume is greater than the amount of thelight scattering material of the light scattering member per unitvolume.